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AI chips are pushing heat flux levels, overwhelming conventional cooling methods. This showcase explores how electrochemical additive manufacturing (ECAM) can be used to enhance thermal performance within existing infrastructure, from direct-to-chip single-phase cooling, through to direct-to-silicon immersion. Join this session to:

• Discover how to target hotspots and direct flow to flatten temperature variance
• Cut energy use and improve PUE to deliver immediate ROI
• Learn how ECAM-enabled cooling can extend hardware life reducing throttling incidence
• Avoid contaminants seeping into cold plate fins to maintain performance