Cooling the cutting edge of AI technologies
This session took place on August 1, 2024
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This episode will stream live at 9:00am ET
Effective thermal management and power efficiency are critical to ensuring the performance and longevity of cutting edge AI chips. In this session, we delve into the technical challenges, as well as the way around, for managing these demands. During this episode, we address:
- The role of chip level cooling in effective heat management
- How do different thermal management solutions stack up?
- What comes next in cooling and power management technologies?
- How strategic partnerships with chip manufacturers allow cooling solutions that maximise both efficiency and performance
- Speakers
- Stephen Worn , DatacenterDynamics
- Husam Alissa , Microsoft
- Greg Stover , Vertiv
- Bahareh Eslami , NVIDIA
- Brought to You by
- Vertiv