Located in the heart of Silicon Valley, Colovore was created specifically to meet the area’s need for data center infrastructure able to support next-generation high-performance computing (HPC), with up to 50 kilowatts (kW) of power and cooling capacity in every cabinet.
In this case study, we explore how Colovore implemented a robust thermal management solution, including rack door cooling modules, to:
- Enable fully-packed, top-to-bottom rack deployments with no wasted or unusable rack unit slots
- Increase operating and capital efficiency due to significant reductions in required cabinets and data center floor space
- Achieve lower operating costs with savings passed on to customers
- Improve cooling effectiveness enabling continued support of advanced applications and higher rack densities