Interconnect company Point2 Technology has raised $22.6 million in an extended Series B funding round.

The round was led by Bosch Ventures and Molex, a manufacturer of electronic, electrical, and fiber optic connectivity systems, with participation from other, unnamed, investors.

Founded in 2016 and headquartered in San Jose, California, Point2 provides ultra-low power interconnect solutions that improve the performance and capacity needed for next generation hyperscale, cloud data center, and 5G wireless networks.

In addition to the extended funding round, Point2 is also partnering with Molex to commercialize its E-tube technology, a scalable interconnect platform that has an 80 percent lower weight and 50 percent less bulk than copper cables; and is expected to reduce power consumption and costs by 50 percent when compared to optical cables.

"We are thrilled to have support from Bosch, a Tier 1 supplier in the automotive industry, and from Molex as we advance our mission to revolutionize interconnect technology in AI/ML data centers and next-generation automotive applications," said Sean Park, Point2's founder and CEO.

"Our collaboration with Bosch underlines the importance and high potential of Point2’s low-power, low-latency, scalable interconnect technologies in the expansive automotive sector and further amplifies our impact in connecting AI workloads for the growing data center market.”

This latest funding round extends the previously announced Series B funding round of $22 million led by GU Equity Partners in May 2022.

According to Crunchbase, Point2 has raised $44.6 million to date over four funding rounds.