Compute | New York // Presentation: Cooling compute: Building the near-future of direct-to-chip cooling

Exponential growth of AI workloads is driving the need for high performance chip packages that cannot be thermally managed by energy- and water-intensive chilled air-cooling solutions implemented in Data Centers today. Consequently, energy-efficient thermal management of IT Equipment utilizing some form of liquid cooling is gaining traction from a performance, cost and sustainability perspective. This talk will cover exemplar near future direct-to-chip cooling highlighting the benefits (and challenges) of utilizing liquid cooling.

The information, data, or work presented herein was funded in part by the Advanced Research Projects Agency-Energy (ARPA-E), U.S. Department of Energy, under Award Number DE-AR0001577. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof.