Connect | Southern Europe // Major Panel: Liquid cooling as a shared strategy among manufacturers and operators in the high-density era

As AI and GPU densities rise, liquid cooling is becoming a strategic requirement rather than an option. This panel brings together data centre developers, chip manufacturers, and Alfa Laval to explore how silicon, facility design, and cooling technologies must evolve together to enable scalable and sustainable high-density compute. Ideal for operators, designers, and technologists preparing for the next generation of workloads.