Dr. Demetriou is a Senior Engineer at IBM Corporation in the IBM Systems’ Advanced Thermal Energy Efficiency Lab and an Adjunct Associate Professor at Columbia University. He received a Ph.D. in Mechanical and Aerospace Engineering from Syracuse University. His research is focused on the analysis, application, and optimization of thermal management and energy conversion systems, particularly in the area of high-density data centers, high-performance buildings, and advanced electronics cooling technologies. Dr. Demetriou is the current Chair of ASHRAE Technical Committee 9.9 on Mission Critical Facilities, Data Centers, Technology Spaces, and Electronic Equipment. He has co-authored four books in the ASHRAE Datacom Series, authored or coauthored over thirty journal and peer-reviewed publications, and has been granted nineteen United States patents. His work has been awarded numerous honors, including the ASHRAE Willis H. Carrier Award, All-University Doctoral Prize at Syracuse University, IEEE TCPMT Best Paper Award, ASME Journal of Electronics Packaging Best Paper Award, ASME InterPACK Best Paper Award in Data Centers and Energy Efficient Electronic Systems, and the Best Paper in the International Journal of Building Simulations. He also holds a MS in Mechanical and Aerospace Engineering from Syracuse University and a BS in Mechanical Engineering from Manhattan College.