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The future of chip design: Power density and thermal requirements

This episode will stream live at 9am ET

As chips advance and push performance limits, managing power density and thermal requirements have become a growing challenge for both manufacturers and data centers. While power and cooling are familiar industry challenges, understanding the technical complexities of balancing computational power, heat dissipation, and energy efficiency in next gen chip architecture is critical. Key considerations we'll address include:

  • The impact of transistor densities on power and heat
  • How 3D stacking and chiplet architectures handle thermal management
  • Monolithic versus non-homogenous chiplets: How does this affect power and heat?
  • How are we cooling the cutting edge of chips?