Toshiba’s modular cooling

We caught up with Makoto Honda, Chief Specialist of the Data Centre solution Engineering Group at Toshiba to find out more about Toshiba’s latest modular cooling unit, redesigned as part of a play for the wider Asia Pacific market.


The solution, originally designed for the Japanese climate, was launched as part of pilot project for Singapore’s IDA and is now in use at the Nanyang Technological University, which helped co-develop the technology.


Honda spoke with us from DatacenterDynamic’s Singapore event held last month.


Mokoto also details in a second video how Toshiba is looking to expand its modular cooling solutions, with some announcements due next year.

Published 8 November, 2012 by Penny Jones


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