Chiplet interconnect manufacturer Eliyan has closed a $60 million Series B funding round.

The round was co-led by Samsung Catalyst Fund and Tiger Global Management and included participation from existing investors, including Intel Capital, SK Hynix, Cleveland Avenue, and Mesh Ventures.

Founded in 2021 by Ramin Farjadrad, the former CTO and VP of networking at Marvell Semiconductor, and Syrus Ziai, Eliyan’s chiplet interconnect technology speeds up the processing for AI chips, with the company claiming it achieves up to four times the performance and half the power of other solutions.

The company’s NuLink PHY addresses both die-to-die and die-to-memory interconnect challenges through its Universal Memory Interface (UMI), a bi-directional interconnect method that enables a bandwidth-efficient connection to memory, in both standard organic substrates and advanced packaging.

Chiplets are tiny integrated circuits with specialized functions, which can be combined to make larger integrated circuits. They contain multiple smaller dies, instead of one monolithic die.

The funding round follows a $40 million Series A round that the company closed in 2022. Eliyan said that the funding will allow the company to continue addressing the “most pressing challenges facing the design and manufacturing of advanced AI chips” by further developing its chiplet interconnect technology to enable chip makers to “achieve new levels of performance and power efficiency.”

Writing on LinkedIn, Eliyan’s CEO Farjadrad said that he was excited for the company to start a new chapter, having received over $100 million in funding from existing and new investors.

He added: “[The funding will] turn our unique technologies into ultimate chiplet products that will empower the future AI systems. Many thanks to our great team for their commitment and many thanks to our partners, customers and investors for their trust in our ability to execute and deliver the best.”